Tower Semiconductor launches a 300mm 65nm BCD power management platform for mobile, AI, and data center applications.
Quiver AI Summary
Tower Semiconductor has introduced its new 300mm 65nm 3.3V-based BCD Power Management Platform (PML), enhancing its existing 5V-based solutions that are currently in high-volume production. This innovative platform is designed to meet the low-voltage needs of mobile devices while optimizing power efficiency and density for AI and data center applications. It includes advanced LDMOS devices that provide high power conversion efficiency, enabling applications in PMICs, audio ICs, and high-power voltage regulators for GPUs and CPUs. The introduction of the PML reflects Tower Semiconductor's commitment to delivering cutting-edge technology to its customers in key markets.
Potential Positives
- Introduction of a new 300mm 65nm 3.3V-based BCD Power management platform, PML, highlighting the company's innovation in power management technology.
- The platform addresses growing demands for high power efficiency and power density in mobile, AI, and data center applications, indicating its relevance in key markets.
- Achieves high power conversion efficiency for fast switching converters, showcasing potential advantages for customers in reducing power consumption and extending battery life in their products.
- Reflects Tower Semiconductor's commitment to providing industry-leading solutions, enhancing customer competitiveness in evolving technology markets.
Potential Negatives
- The announcement of the new 300mm 65nm BCD Power management platform may indicate that the company is facing competitive pressure to innovate, possibly reflecting previous shortcomings in their existing product offerings.
- The reliance on forward-looking statements introduces uncertainty, which could affect investor confidence and perceptions of the company's stability and reliability.
- The emphasis on high-performance and high-efficiency may suggest that existing products are not meeting market demands as effectively, raising concerns about the company's current product performance and market positioning.
FAQ
What is Tower Semiconductor's new PML platform?
Tower Semiconductor's new PML platform is a 300mm 65nm BCD Power management solution designed for mobile, AI, and data center applications.
How does the PML platform improve power efficiency?
The PML platform features LDMOS devices with ultra-low on-resistance, achieving the highest power conversion efficiency for fast switching converters.
What are the key benefits of the 3.3V-based power management platform?
This platform addresses low-voltage requirements, enhances power efficiency, and improves battery life for battery-operated applications.
Where is the PML platform currently being manufactured?
It is in high-volume production in Japan and being qualified at the Albuquerque manufacturing site in New Mexico, USA.
Who can benefit from Tower Semiconductor's new technology?
Manufacturers of mobile devices, AI technologies, and data centers can leverage this new technology for developing industry-leading products.
Disclaimer: This is an AI-generated summary of a press release distributed by GlobeNewswire. The model used to summarize this release may make mistakes. See the full release here.
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Full Release
Delivering high-efficiency power, high-performance analog, and high-density digital in a single power management platform for mobile, AI, and data center applications
MIGDAL HAEMEK, Israel, December 23, 2024
– Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced its new 300mm 65nm 3.3V-based BCD Power management platform, PML, in addition to its successful 5V-based offering already in high-volume production in Japan and that which is being qualified in Albuquerque, New Mexico, USA, manufacturing site. This new, cutting-edge platform addresses the stringent low-voltage requirements of mobile devices and meets the growing demands for high power efficiency and power density in AI and data center applications.
The advanced 300mm BCD PML offering comprises LDMOS devices with ultra-low on-resistance and best-in-class figure-of-merit, achieving highest power conversion efficiency for fast switching converters. In addition, it features power devices with wide voltage range and a nominal 3.3V gate voltage that can be substantially overdriven and underdriven addressing products such as PMIC, Audio IC, and high-power voltage regulators for GPU and CPU. These advantages enable users to achieve outstanding performance in power consumption and extend battery life in battery operated applications.
“Our new PML platform exemplifies Tower Semiconductor’s continuous success in providing cutting-edge power management technology solutions,”
said Shimon Greenberg, General Manager of Power Management Business Unit.
“Specifically designed for advanced power management applications, this innovation empowers our customers to develop industry-leading products with a competitive edge that address the evolving demands of the strategic mobile, AI, and data center markets”.
For additional information on Tower’s PM technology platform, please visit
here
.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns two facilities in Israel (150mm and 200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo, shares a 300mm facility in Agrate, Italy, with ST as well as has access to a 300mm capacity corridor in Intel’s New Mexico factory. For more information, please visit:
www.towersemi.com
.
Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.
Tower Semiconductor Investor Relations Contact:
Noit Levy | +972-4-604-7066 |
noitle@towersemi.com
Tower Semiconductor Company Contact:
Orit Shahar | +972-74-7377440 |
oritsha@towersemi.com
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