Micron Technology announces groundbreaking for Singapore's first High-Bandwidth Memory advanced packaging facility, set to enhance AI growth.
Quiver AI Summary
Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony featured notable attendees, including Deputy Prime Minister Gan Kim Yong. The facility, with operations starting in 2026, aims to address the growing demand for advanced memory solutions driven by artificial intelligence, with an investment of approximately $7 billion expected to create around 1,400 jobs initially, potentially rising to 3,000 in the future. This project will enhance Singapore's semiconductor ecosystem and align with Micron's sustainability goals, featuring environmentally friendly technologies and automation. The new facility supports long-term manufacturing needs for NAND as well.
Potential Positives
- Micron Technology's new High-Bandwidth Memory (HBM) facility represents a significant investment of approximately US $7 billion, indicating strong confidence in future growth opportunities, especially in AI markets.
- The facility, the first of its kind in Singapore, is expected to create around 1,400 jobs initially, potentially expanding to 3,000 jobs, thereby contributing to local employment and economic growth.
- The new HBM advanced packaging facility will enhance Singapore's semiconductor ecosystem, reflecting a commitment to innovation and contributing to the region's global competitiveness in the semiconductor supply chain.
- The facility will incorporate sustainable practices and technologies, aligning with Micron's sustainability commitments and setting a benchmark for environmentally responsible manufacturing in the industry.
Potential Negatives
- Initial operations for the new facility are not expected to begin until 2026, which may lead to a delayed return on the substantial investment of approximately US $7 billion.
- Despite the anticipated creation of 1,400 jobs, the facility's long-term job growth projection to 3,000 jobs suggests a cautious approach to scaling up labor in response to future demand.
- The need for flexibility in managing capacity ramps may indicate uncertainty in market demand, which could affect long-term growth and stability.
FAQ
What is the new facility that Micron is building in Singapore?
Micron is building a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, which will be the first of its kind in the country.
When will operations for the new Micron facility begin?
Operations for the new HBM advanced packaging facility are scheduled to begin in 2026.
How many jobs will the new facility create?
The new facility will initially create around 1,400 jobs, with plans to expand to approximately 3,000 jobs in the future.
What investment is Micron making for this facility?
Micron is investing approximately US $7 billion (SG$9.5 billion) in the new HBM advanced packaging facility.
How will the facility contribute to sustainability?
The new facility will include technologies for greenhouse gas abatement, water recycling, and waste circularity, aligning with Micron's sustainability commitments.
Disclaimer: This is an AI-generated summary of a press release distributed by GlobeNewswire. The model used to summarize this release may make mistakes. See the full release here.
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Full Release
SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore. Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Tan Boon Khai, CEO of JTC Corporation.
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore’s local semiconductor ecosystem and innovation.
“As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly,” said Sanjay Mehrotra, president and CEO of Micron. “With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.”
Micron’s HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations.
Png Cheong Boon, Chairman of the Singapore Economic Development Board, said, “We welcome this significant investment by Micron, which reflects its confidence in Singapore’s competitiveness as a critical node in the global semiconductor supply chain. This is Singapore’s first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth. It expands Singapore’s partnership with Micron and further strengthens the semiconductor ecosystem in Singapore.”
Micron’s future expansion plans in Singapore will also support long-term manufacturing requirements for NAND.
Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand.
Micron’s current facility in Singapore is the first front-end semiconductor fab in the world to be recognized as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum. The new HBM advanced packaging facility will be built in alignment with Micron’s sustainability commitments. It will feature technologies such as a greenhouse gas abatement, water recycling and waste circularity (reduce, reuse, recycle, recover). The new building will be highly automated through AI-based intelligent solutions and designed to meet the Leadership in Energy and Environmental Design (LEED) certification requirements.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.
© 2025 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.
Micron Media Relations Contact
Mark Plungy
Micron Technology, Inc.
+1 (408) 203-2910
mplungy@micron.com
Micron Investor Relations Contact
Satya Kumar
Micron Technology, Inc.
+1 (408) 450-6199
satyakumar@micron.com
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